• MediaTek has unveiled a chipset for the premium 5G smartphone segment – the Dimensity 8300.
• The new processor promises 20 percent better performance compared to its predecessor.
• MediaTek expects the Dimensity 8300 to feature in new phones before the end of 2023.

Following hot on the heels of its flagship Dimensity 9300 chipset that was revealed earlier this month, MediaTek has another offering that it has unveiled in the form of the Dimensity 8300.

While this new chipset is not in the same flagship territory as the 9300, its Taiwanese silicon maker has imbued it with capabilities suitable for the premium 5G smartphone space. To that end, it features TSMC’s 2nd generation 4nm process.

This octa-core processor also features four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture, according to MediaTek. The company also points out that the Dimensity 8300 is 20 percent more powerful on the CPU side of things, while delivering 30 percent peak gains when it comes to power efficiency too.

“Additionally, the Dimensity 8300’s Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. Plus, the chipset’s impressive memory and storage speeds ensure users can enjoy smooth and dynamic experiences in gaming, lifestyle applications, photography, and more,” the company noted in a release shared with Hypertext.

“With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to pick and choose between accessibility and premier experiences like flagship-grade memory or accelerated AI capabilities—they can have it all. The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency,” added Dr. Yenchi Lee, Deputy GM of MediaTek’s Wireless Communications Business Unit.

Along with the aforementioned improvements expected of a new generation of SoC, MediaTek has highlighted the AI capabilities of the 8300 as well, which is becoming an increasingly important feature for silicon makers to consider given the industry-wide obsession with artificial intelligence this year.

Here MediaTek says the 8300 can support full generative AI thanks to the APU 780 AI processor integrated into the chipset.

“This enables the Dimensity 8300 to provide support to developers to build innovative applications that leverage large language models (LLMs) up to 10B, as well as stable diffusion. The APU 780 features the same architecture as the flagship Dimensity 9300 SoC, resulting in 2x improvement in INT and FP16 computation and a 3.3x boost in AI performance over the Dimensity 8200,” MediaTek explained.

As for when you’ll be able to see the Dimensity 8300 in an actual device, MediaTek already expects its OEMs to feature it in new hardware before the end of 2023. Whether that will include devices destined for SA too, remains to be seen.